- Manufacturer：
-
- Aavid (4)
- Package Cooled：
-
- Attachment Method：
-
- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Material Finish：
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7 Records
| Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
Aavid | BOARD LEVEL HEAT... |
1 |
11,654
In-stock
|
Get Quote | ||
|
|
Aavid | BOARD LEVEL HEAT... |
1 |
49,124
In-stock
|
Get Quote | ||
|
|
Aavid | BOARD LEVEL HEAT... |
1 |
27,513
In-stock
|
Get Quote | ||
|
|
Aavid | HEAT SINK |
1 |
26,271
In-stock
|
Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | PCIE EXTRUSION P... |
1 |
15,158
In-stock
|
Get Quote | ||
|
|
ASSMANN WSW Components | HEATSINK ALUM AN... |
1 |
22,228
In-stock
|
Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | PCIE EXTRUSION P... |
1 |
30,626
In-stock
|
Get Quote |
